Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper-Reference-Cited by-同舟云学术

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Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper

Published:2024-08 Issue: Volume:214 Page:114056
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Zhang Minghui,Gao Li-Yin,Zhang Qi,Wang Dawei,Dong Wei,Zhao Ning,Liu Zhi-Quan

Funder

National Natural Science Foundation of China

Special Project for Research and Development in Key areas of Guangdong Province

Basic and Applied Basic Research Foundation of Guangdong Province

Publisher

Elsevier BV

Reference35 articles.

1. Enhancement of electromigration lifetime of copper lines by eliminating nanoscale grains in highly 〈111〉−oriented nanotwinned structures;Tran;J. Mater. Res. Technol.,2021

2. Ultrahigh strength and high electrical conductivity in copper;Lu;Science,2004

3. Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding;Tseng;Sci. Rep.,2018

4. Nanotwinned microstructure engineering of electroplated copper for enhanced anti-corrosion in alkaline medium;Liu;Met. Mater. Int.,2023

5. Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper;Hsiao;Science,2012

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