Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding

Published:2018-07-13 Issue:1 Volume:8 Page:
ISSN:2045-2322
Container-title:Scientific Reports
language:en
Short-container-title:Sci Rep

Author:

Tseng Chih-Han,Tu K. N.,Chen Chih

Funder

Ministry of Science and Technology, Taiwan (Ministry of Science and Technology of Taiwan)

Publisher

Springer Science and Business Media LLC

Subject

Multidisciplinary

Link

http://www.nature.com/articles/s41598-018-28812-0.pdf

Reference29 articles.

1. Lu, L., Shen, Y., Chen, X., Qian, L. & Lu, K. Ultrahigh strength and high electrical conductivity in copper. Science. 304, 422–426 (2004).

2. Lu, L., Chen, X., Huang, X. & Lu, K. Revealing the maximum strength in nanotwinned copper. Science. 323, 607–610 (2009).

3. Chen, K. C., Wu, W. W., Liao, C. N., Chen, L. J. & Tu, K. N. Observation of atomic diffusion at twin-modified grain boundaries in copper. Science. 321, 1066–1069 (2008).

4. Hsiao, H.-Y. et al. Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper. Science. 336, 1007–1010 (2012).

5. Liu, C. M., Lin, H. W., Lu, C. L., & Chen, C. Effect of grain orientations of Cu seed layers on the growth of <111> -oriented nanotwinned Cu. Sci. Rep. 4, (2014).

Cited by 64 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Improvement of heat aging resistance and tensile strength of SAC305/Cu solder joints by multi-element microalloying;Intermetallics;2024-10

2. Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding;Journal of Electroanalytical Chemistry;2024-09

3. Enhancement of Low-Temperature Cu-Cu Bonding by Metal Alloy Passivation in Ambient Atmosphere;IEEE Electron Device Letters;2024-08

4. Effect of impurities on anisotropic grain growth in (111)-oriented nanotwinned copper;Materials Characterization;2024-08

5. Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu;ACTA METALL SIN;2024

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3