Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/srep06123.pdf
Reference22 articles.
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3. Thompson, C. V. et al. Electromigration and IC interconnects. MRS Bulletin XVIII 12, 19 (1993).
4. Hauschildt, M. et al. Analysis of electromigration statistics for Cu interconnects. Appl. Phys. Lett. 88, 211907 1–3 (2006).
5. Tu, K. N. Recent advances on electromigration in very-large-scale-integration of interconnects. J. Appl. Phys. 94, 5451–5473(2003).
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