Enhancement of Low-Temperature Cu-Cu Bonding by Metal Alloy Passivation in Ambient Atmosphere-Reference-Cited by-同舟云学术

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Enhancement of Low-Temperature Cu-Cu Bonding by Metal Alloy Passivation in Ambient Atmosphere

Published:2024-08 Issue:8 Volume:45 Page:1500-1503
ISSN:0741-3106
Container-title:IEEE Electron Device Letters
language:
Short-container-title:IEEE Electron Device Lett.

Author:

Hsu Mu-Ping¹^ORCID,Chen Chih-Han²,Hong Zhong-Jie²,Lin Tai-Yu¹,Hung Ying-Chan³,Chen Kuan-Neng¹^ORCID

Affiliation:

1. Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan

2. International College of Semiconductor Technology, National Yang-Ming Chiao Tung University, Hsinchu, Taiwan

3. Solar Applied Materials Technology Company Ltd., Tainan, Taiwan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/55/10612269/10559988.pdf?arnumber=10559988

Reference22 articles.

1. Advanced System in Package Enabled by Wafer Level Heterogeneous Integration of Chiplets

2. Advanced Packaging Technology Platforms for Chiplets and Heterogeneous Integration

3. Advanced Substrate Packaging Technologies for Enabling Heterogeneous Integration (HI) Applications

4. Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints

5. Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Molecular dynamics simulation study of Zr interposer promoting Cu-Cu low-temperature hybrid bonding;Materials Today Communications;2024-08

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