Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Microstructure evolution of eutectic Sn-Ag solder joints
2. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
3. Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering
4. Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints
5. Interfacial reactions and impact reliability of Sn–Zn solder joints on Cu or electroless Au/Ni(P) bond-pads
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