Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2890072
Reference25 articles.
1. Kinetics of interfacial reaction in bimetallic CuSn thin films
2. Three‐dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu
3. Reaction-Diffusion in the Cu–Sn System
4. Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow
5. The role of Cu-Sn intermetallics in wettability degradation
Cited by 65 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Cu/Ni/Cu/Sn1.8Ag microbump structure for void-free interface under long time high-temperature storage;Journal of Alloys and Compounds;2024-11
2. Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu;Materials;2024-05-04
3. Effects of suppressors on the incorporation of impurities and microstructural evolution of electrodeposited Cu solder joints;Journal of the Taiwan Institute of Chemical Engineers;2023-08
4. Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions;Journal of Electronic Materials;2023-04-07
5. Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review;Journal of Advanced Joining Processes;2022-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3