The role of Cu-Sn intermetallics in wettability degradation-Reference-Cited by-同舟云学术

The role of Cu-Sn intermetallics in wettability degradation

Published:1995-10 Issue:10 Volume:24 Page:1429-1434
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Reynolds H. L.,Morris J. W.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02655460.pdf

Reference20 articles.

1. A.D. Romig, Jr., Y.A. Chang, J.J. Stephens, D.R. Frear, V. Marcotte and C. Lea,Solder Mechanics—A State of the Art Assessment eds. D.R. Frear, W.B. Jones and K.R. Kinsman, (Warrendale, PA: TMS, 1991), p. 28.

2. F. J. Yostand A. D. Romig,Jr.,Mat. Res.Soc. Symp Proc. 108, (1988), p. 385.

3. M & T Chemicals Inc., Rahway, NJ.

4. D. Schoenthaler, WCIII-03 (1983).

5. C.J. Thwaites,Trans. Inst. Metal Finish. 6, 203 (1959).

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