Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Cited by
20 articles.
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1. The role of intermetallic compounds in lead‐free soldering;Soldering & Surface Mount Technology;1998-12-01
2. The role of Cu-Sn intermetallics in wettability degradation;Journal of Electronic Materials;1995-10
3. Oxidation of Solder Coatings;The Mechanics of Solder Alloy Wetting and Spreading;1993
4. Solderability Testing;The Mechanics of Solder Alloy Wetting and Spreading;1993
5. Applications of the Mössbauer Effect in Electrolysis;Industrial Applications of the Mössbauer Effect;1986