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Solderability Testing

Published:1993 Issue: Volume: Page:9-33
ISSN:
Container-title:The Mechanics of Solder Alloy Wetting and Spreading
language:
Short-container-title:

Author:

Hampshire Bill,Wolverton Mike

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4684-1440-0_2.pdf

Reference34 articles.

1. Ackroyd, M. L. 1976. Proc. INTERNEPCON UK. Brighton, England, pp. 214–35.

2. Ackroyd, M. L. 1977. Publication No. 531 Uxbridge, England: International Tin Research Institute.

3. Ackroyd, M. L., and C. A. MacKay. 1977a. Circuit World. 3(2):6–12

4. Ackroyd, M. L., and C. A. MacKay. 1977b. Publication No, 529. Uxbridge, England: International Tin Research Institute.

5. Davis, P. E., M. E. Warwick, and P. J. Kay. 1982. Plating and Surface Finishing 69:72–6.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type;Applied Surface Science;2024-09

2. Methodology for Solderability Measurement of Plated Through Holes Using Wetting Balance Test;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

3. Capillary Flow Solder Wettability Test*;Soldering & Surface Mount Technology;1997-06-01

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