Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing

Author:

Wang Jing,Chen Guang,Sun Fulong,Zhou Zhaoxia,Liu Zhi-Quan,Liu Changqing

Funder

Huawei Technologies Ltd., Shenzhen, China

Publisher

Elsevier BV

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Reference33 articles.

1. A review of accelerated ageing of printed boards with respect to solderability;Wilson;Circuit World,1978

2. Oxidation of liquid solders for die attachment;Song;Corros. Sci.,2010

3. The role of Cu-Sn intermetallics in wettability degradation;Reynolds;J. Electron. Mater.,1995

4. Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, EIA/IPC/JEDEC J-STD-002D;EIA,2013

5. Environmental Testing – Part 2-20: Tests – Test T: Test Methods for Solderability and Resistance to Soldering Heat of Devices With Leads, IEC 60068-2 -20;IEC,2008

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