Oxidation of liquid solders for die attachment
Author:
Publisher
Elsevier BV
Subject
General Materials Science,General Chemical Engineering,General Chemistry
Reference22 articles.
1. Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate
2. Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder
3. Zn-Al based alloys as Pb-free solders for die attach
4. Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications
5. Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates
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1. Effect of Ga on the Oxide Film Structure and Oxidation Resistance of Sn–Bi–Zn Alloys as Heat Transfer Fluids;Materials;2020-11-30
2. Bi-Based Interconnect Systems and Applications;Harsh Environment Electronics;2019-03-29
3. Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing;Corrosion Science;2018-07
4. Microstructures and properties of Bi 10Ag high temperature solder doped with Cu element;Microelectronics Reliability;2018-01
5. Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder;Microelectronics Reliability;2017-07
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