Microstructures and properties of Bi 10Ag high temperature solder doped with Cu element

Author:

Yin Limeng,Li Dong,Yao Zongxiang,Wang Gang,Blackburn Adrian

Funder

National Natural Science Foundation of China

Research Program of Frontier and Applied Basic Research of Chongqing

Achievement Transfer Program of Institutions of Higher Education in Chongqing

Scientific and Technological Research Program of Chongqing Municipal Education Commission

State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. Interfacial reaction of Bi-Ag and Bi-Sb solders on copper substrate with multiple reflow number;Nahavandi;Mater. Res. Innov.,2014

2. Effect of strain rate and temperature on tensile properties of Bi-based lead-free solder;Haidong;Mater. Trans.,2016

3. Correlation between microstructure and hardness of a Bi-1.5 wt% Ag lead-free solder alloy;Spinelli,2016

4. Effect of Sb addition on Bi-2.6 Ag-0.1 Cu solders for high-temperature applications;Kim;J. Alloys Compd.,2014

5. Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications;Spinelli;Mater. Des.,2014

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3