Author:
Yin Limeng,Li Dong,Yao Zongxiang,Wang Gang,Blackburn Adrian
Funder
National Natural Science Foundation of China
Research Program of Frontier and Applied Basic Research of Chongqing
Achievement Transfer Program of Institutions of Higher Education in Chongqing
Scientific and Technological Research Program of Chongqing Municipal Education Commission
State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. Interfacial reaction of Bi-Ag and Bi-Sb solders on copper substrate with multiple reflow number;Nahavandi;Mater. Res. Innov.,2014
2. Effect of strain rate and temperature on tensile properties of Bi-based lead-free solder;Haidong;Mater. Trans.,2016
3. Correlation between microstructure and hardness of a Bi-1.5 wt% Ag lead-free solder alloy;Spinelli,2016
4. Effect of Sb addition on Bi-2.6 Ag-0.1 Cu solders for high-temperature applications;Kim;J. Alloys Compd.,2014
5. Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications;Spinelli;Mater. Des.,2014
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