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Die-attach bonding at 230 °C using micron Sn-coated Zn particles for high-temperature applications

  • Published:2022-11 Issue: Volume:21 Page:4490-4499
  • ISSN:2238-7854
  • Container-title:Journal of Materials Research and Technology
  • language:en
  • Short-container-title:Journal of Materials Research and Technology

Author:

Wang Fengyi,Wang Xinjie,Mao Xingchao,Duan Fangcheng,Hang Chunjin,Chen Hongtao,Li Mingyu

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference26 articles.

1. Power module electronics in HEV/EV applications: new trends in wide-bandgap semiconductor technologies and design aspects;Matallana;Renew Sustain Energy Rev,2019

2. State-of-the-art power electronics systems for solar-to-grid integration;Vakacharla;Sol Energy,2020

3. Energy, environment, and advances in power electronics;Bose;IEEE Trans Power Electron,2000

4. Gallium-nitride semiconductor technology and its practical design challenges in power electronics applications: an overview;Lastname,2019

5. Cascode GaN/SiC: a wide-bandgap heterogenous power device for high-frequency applications;Xu;IEEE Trans Power Electron,2020

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