Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder
Author:
Affiliation:
1. Faculty of Science and Technology, Gunma University
2. Fuji Electric Co., Ltd.
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/57/6/57_MD201517/_pdf
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