Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference25 articles.
1. First high-temperature electronics products survey;Normann,2005
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3. Wetting and soldering behavior of eutectic Au–Ge alloy on Cu and Ni substrates;Leinenbach;J Electr Mater,2011
4. Wetting of Cu and Al by Sn–Zn and Zn–Al eutectic alloys;Pstruś;J Mater Eng Perform,2012
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