Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference25 articles.
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3. Wetting and soldering behavior of eutectic Au–Ge alloy on Cu and Ni substrates;Leinenbach;J Electr Mater,2011
4. Wetting of Cu and Al by Sn–Zn and Zn–Al eutectic alloys;Pstruś;J Mater Eng Perform,2012
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1. Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al;Journal of Materials Science: Materials in Electronics;2023-08
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3. Effects of Zn Addition on Dendritic/Cellular Growth, Phase Formation, and Hardness of a Sn–3.5 wt% Ag Solder Alloy;Advanced Engineering Materials;2022-11-22
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