Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate
Author:
Affiliation:
1. Department of Adaptive Machine Systems, Osaka University
2. Institute of Scientific and Industrial Research, Osaka University
3. Nihon Genma MFG Co. Ltd.
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/46/11/46_11_2413/_pdf
Reference15 articles.
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4. 4) J. H. Kim, S. W. Jeong and H. M. Lee: Mater. Trans. 43 (2002) 1873–1878.
5. 5) J. W. Nah, J. H. Kim, H. M. Lee and K. W. Paik: Acta Mater. 52 (2004) 129–136.
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