Enhancing Die and Wire Bonding Process Reliability: Microstructure Evolution and Shear Strength Analysis of Sn-Sb Backside Metal
Author:
Affiliation:
1. Department of Advanced Materials Science and Engineering, Kumoh National Institute of Technology, Gumi 39177, Republic of Korea
Publisher
The Materials Research Society of Korea
Link
https://journal.mrs-k.or.kr/articles/pdf/doi/10.3740/MRSK.2024.34.3.170.pdf
Reference16 articles.
1. Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation
2. Survey of High-Temperature Reliability of Power Electronics Packaging Components
3. Wafer back metallization for semiconductor packaging
4. Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints
5. Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use
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