Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference82 articles.
1. Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
2. Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils
3. Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interface
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