Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders-Reference-Cited by-同舟云学术

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Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders

Published:1996-07 Issue:7 Volume:25 Page:1113-1120
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Kang S. K.,Rai R. S.,Purushothaman S.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02659912.pdf

Reference18 articles.

1. B.R. Allenby et al.,Proc. Surface Mount Intl., San Jose, CA, Aug. 1992, vol. 1, p.l.

2. P.T. Vianco and F.G. Yost,Sandia Report, SAND92-0211, Sandia Nat. Lab., April 1992.

3. W.B. Hampshire,Soldering and Surface Mount Techn. 14, 49, (June) (1993).

4. J.S. Hwang and Z. Guo,Proc. Surface Mount Intl., San Jose, CA, p. 732, August 1993.

5. J.H. Vincent and G. Humpton,Circuit Assembly, July 1994, p. 38.

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