Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications-Reference-Cited by-同舟云学术

Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications

Published:2002 Issue:8 Volume:43 Page:1873-1878
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Kim Jong Hoon¹,Jeong Sang Won¹,Lee Hyuck Mo¹

Affiliation:

1. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/43/8/43_8_1873/_pdf

Reference16 articles.

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2. 2) M. McCormack and S. Jin: JOM 45 (1993) 36–40.

3. 3) G. L. Ginsberg and D. P. Schnorr: Multichip Modules and Related Technologies, (McGraw-Hill, New York, 1994) pp. 135–138.

4. 4) S. K. Kang, J. Horkans, P. C. Andricacos, R. A. Carruthers, J. Cotte, M. Datta, P. Gruber, J. M. E. Harper, K. Kwietniak, C. Sambucetti, L. Shi, G. Brouillette and D. Danovitch: 49th Electronic Components and Technology Conference, (San Diego, 1999) 283–288.

5. 5) CRC Handbook of Chemistry and Physics, 79th Ed., (CRC Press, Cleveland, 1998-1999) pp. 12–45.

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