Bi-Based Interconnect Systems and Applications-Reference-Cited by-同舟云学术

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Bi-Based Interconnect Systems and Applications

Published:2019-03-29 Issue: Volume: Page:191-209
ISSN:
Container-title:Harsh Environment Electronics
language:
Short-container-title:

Author:

Noor Manifa¹,Sharif Ahmed²

Affiliation:

1. Bangladesh University of Engineering and Technology; Department of Glass and Ceramic Engineering; Old Academic Building, Zahir Raihan Road Dhaka 1000 Bangladesh

2. Bangladesh University of Engineering and Technology; Department of Materials and Metallurgical Engineering; Old Academic Building, Zahir Raihan Road Dhaka 1000 Bangladesh

Publisher

Wiley-VCH Verlag GmbH & Co. KGaA

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/9783527813964.ch9/fullpdf

Reference37 articles.

1. Research and prospect of binary high-temperature Pb-free solders;Du;Soldering and Surface Mount Technology,2015

2. In search of new lead-free electronic solders;Wood;Journal of Electronic Materials,1994

3. Lead free interconnect materials for the electronics industry

4. Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates;Song;Journal of Electronic Materials,2006

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