Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review-Reference-Cited by-同舟云学术

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Forming mechanism and growth of Kirkendall voids of Sn/Cu joints for electronic packaging: A recent review

Published:2022-11 Issue: Volume:6 Page:100125
ISSN:2666-3309
Container-title:Journal of Advanced Joining Processes
language:en
Short-container-title:Journal of Advanced Joining Processes

Author:

Wang Jianing,Chen Jieshi,Zhang Lixia,Zhang Zhiyuan,Han Yuzhu,Hu Xiaowu,Lu Hao,Zhang Shuye

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Engineering (miscellaneous),Chemical Engineering (miscellaneous)

Reference106 articles.

1. Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints;Anderson;J. Electron. Mater.,2006

2. Effect of Cu additions on mechanical properties of Ni 3 Sn 4 -based intermetallic compounds: first-principles calculations and nano-indentation measurements;Bi;Vacuum,2019

3. Assessing the risk of Kirkendall voiding in Cu3Sn;Borgesen;Microelectron. Reliab.,2011

4. Effect of copper grain size on the interfacial microstructure of a Sn/Cu Joint;Chan;ACS Appl Electron Mater,2020

5. Fabrication of Cu-Ni mixed phase layer using DC electroplating and suppression of Kirkendall voids in Sn-Ag-Cu solder joints;Chee;Electron. Mater. Lett.,2014

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