Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements-Reference-Cited by-同舟云学术

Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements

Published:2019-06 Issue: Volume:164 Page:7-14
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Bi Xiaoyang,Hu Xiaowu,Jiang Xiongxin,Li Qinglin

Funder

National Natural Science Foundation of China

Natural Science Foundation of Jiangxi Province

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference34 articles.

1. Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes;Chen;J. Alloy. Comp.,2017

2. Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer deposited on a Cu substrate;Wang;J. Alloy. Comp.,2016

3. Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment;Yoon;J. Electron. Mater.,2003

4. Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints during isothermal aging process;Tang;J. Mater. Sci.,2014

5. Low-cycle fatigue behavior of 95.8Sn-3.5Ag-0.7Cu solder joints;Tang;J. Electron. Mater.,2013

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