Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment-Reference-Cited by-同舟云学术

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Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment

Published:2003-11 Issue:11 Volume:32 Page:1195-1202
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Yoon Jeong-Won,Lee Chang-Bae,Jung Seung-Boo

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0011-8.pdf

Reference37 articles.

1. M.O. Alam, Y.C. Chan, and K.C. Hung, J. Electron. Mater. 31, 1117 (2002).

2. S.W. Chen and Y.W. Yen, J. Electron. Mater. 28, 1203 (1999).

3. T. Takemoto, A. Matsunawa, and M. Takahashi, J. Mater. Sci. 32, 4077 (1991).

4. C.B. Lee, S.B. Jung, Y.E. Shin, and C.C. Shur, Mater. Trans. 42, 751 (2001).

5. K. Suganuma, T. Shotoku, Y. Nakamura, and K. Niihara, J. Mater. Res. 13, 2859 (1998).

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