Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow-Reference-Cited by-同舟云学术

Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow

Published:2002-10 Issue:10 Volume:31 Page:1117-1121
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Alam M. O.,Chan Y. C.,Hung K. C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0051-5.pdf

Reference24 articles.

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3. The Workshop on Lead Free Program (Herdon, VA: National Electronics Manufacturing Initiative Inc., 2001).

4. S.K. Kang et al., 51st Electronic Components and Technology Conf. (Orlando, FL, USA, 2001), pp. 448–454.

5. T. Taguchi, R. Kato, S. Akita, A. Okuno, H. Suzuki, and T. Okuno, 51st Electronic Components and Technology Conf. (Orlando, FL, USA, 2001), pp. 675–680.

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