Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference45 articles.
1. C. Hu, M. Chen, W. Chiou, C. Doug, 3D multi-chip integration with system on integrated chips (SoIC™), in: 2019 Symposium on VLSI Technology, IEEE, 2019, pp. T20-T21.
2. E. Beyne, D. Milojevic, G. Van der Plas, G. Beyer, 3D SoC integration, beyond 2.5 D chiplets, in: 2021 IEEE International Electron Devices Meeting (IEDM), IEEE, 2021, pp. 3.6. 1-3.6. 4.
3. A. Kumar, N. Chang, D. Geb, H. He, S. Pan, J. Wen, S. Asgari, M. Abarham, C. Ortiz, ML-based Fast On-Chip Transient Thermal Simulation for Heterogeneous 2.5 D/3D IC Designs, in: 2022 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), IEEE, 2022, pp. 1-8.
4. Chiplet meets the real world: Benefits and limits of chiplet designs, in;Naffziger;Symposia on VLSI Technology and Circuits,2020
5. E. Beyne, Heterogeneous system partitioning and the 3D interconnect technology landscape, in: 2020 Symposia on VLSI technology and Circuits, 2020, pp. SC2-2.
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