Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints

Published:2019-05 Issue: Volume:786 Page:677-687
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Sun Lei,Chen Ming-he,Zhang Liang

Funder

National Natural Science Foundation of China

NUAA

Postgraduate Research & Practice Innovation Program of Jiangsu Province

State Key Laboratory of Advanced Brazing Filler Metals & Technology

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference31 articles.

1. Materials, processing and reliability of low temperature bonding in 3D chip stacking;Zhang;J. Alloys Compd.,2018

2. Wafer-level Cu-Cu bonding technology;Tang;Microelectron. Reliab.,2012

3. Interfacial reactions in Cu/Ga and Cu/Ga/Cu couples;Lin;J. Electron. Mater.,2014

4. Adhesive bonding for mechanically stacked solar cells;Mathews;Prog. Photovolt.,2015

5. Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn-Cu binary and Cu-Sn-Cu sandwich structures;Li;J. Alloys Compd.,2016

Cited by 122 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of thermal aging on joint with eutectic SnIn solder by TLP bonding;Materials Science in Semiconductor Processing;2025-01

2. Microstructure modification and mechanical reinforcement in sub-10 μm scale Cu/Sn–Ag/Cu microbump joints via Co-addition of Zn and Ni in Cu substrates;Materials Chemistry and Physics;2024-11

3. Interfacial reaction and strengthening mechanism of thermo-compression bonding foam Ni reinforced SAC105 and SAC105–0.3Ti solder joints;Materials Characterization;2024-09

4. Effect of Al particles addition on microstructure and shear properties of Cu/Sn-1Zn/Cu composite solder joints by transient liquid phase bonding;Materials Today Communications;2024-08

5. Enhancement of Low-Temperature Cu-Cu Bonding by Metal Alloy Passivation in Ambient Atmosphere;IEEE Electron Device Letters;2024-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3