Effect of thermal aging on joint with eutectic SnIn solder by TLP bonding
-
Published:2025-01
Issue:
Volume:185
Page:108878
-
ISSN:1369-8001
-
Container-title:Materials Science in Semiconductor Processing
-
language:en
-
Short-container-title:Materials Science in Semiconductor Processing
Author:
Jin Haibin,
Wang Jianhao,
Yao Yuyuan,
Wang Shuiqing,
Shen Yu-AnORCID