Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition-Reference-Cited by-同舟云学术

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Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition

Published:2019-06 Issue: Volume:758 Page:1-6
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Li Sujie,Zhu Qingsheng,Zheng Boda,Yuan Jie,Wang Xiaojing

Funder

National Natural Science Foundation of China

Science and Technology Program of Shenyang

Jiangsu Planning Project of Science and Technology

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference39 articles.

1. Ultrahigh strength and high electrical conductivity in copper;Lu;Science,2004

2. Superior thermal stability of coherent twin boundaries in nanotwinned metals;Zhang;Scripta Mater.,2012

3. Observation of atomic diffusion at twin-modified grain boundaries in copper;Chen;Science,2008

4. Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper;Hsiao;Science,2012

5. Eliminate Kirkendall voids in solder reactions on nanotwinned copper;Liu;Scripta Mater.,2013

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