Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT®) Packaging with Fine Pitch Embedded Trace RDL

Author:

Jin SangHyun1,Do WonChul1,Jeong JinSuk1,Cha HyunGoo1,Jeong YunKyung1,Khim JinYoung1

Affiliation:

1. Amkor Technology Korea, Inc.,R&D,Incheon,Republic of Korea

Publisher

IEEE

Reference9 articles.

1. High Performance, High Density RDL for Advanced Packaging

2. Next generation panel-scale RDL with ultra small photo vias and ultra-fine embedded trenches for low cost 2.5D interposers and high density fan-out WLPs;liu;Proc Electronic Components Technology Conf (ECTC),2016

3. Novel Approach to Highly Robust Fine Pitch RDL Process

4. Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers

5. Superconformal film growth: Mechanism and quantification

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1. Challenges and Innovations in Dual Damascene Polymer RDL with 2 μm Pitch and Beyond;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Inorganic Capping Layers in RDL Technologies: Process Advantages and Reliability;JOM;2023-08-15

5. Electromigration Performance of Fine-Line Cu Redistribution Layer (RDL) for High-Density Fan-Out Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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