Challenges and Innovations in Dual Damascene Polymer RDL with 2 μm Pitch and Beyond-Reference-Cited by-同舟云学术

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Challenges and Innovations in Dual Damascene Polymer RDL with 2 μm Pitch and Beyond

Published:2024-05-28 Issue: Volume: Page:571-575
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Briggs Benjamin D.¹,Ley Ryan²,Bencher Chris²,Quon Roger³,Chuang C C⁴,Suo Peng⁵,Bum Yong Andy Chang⁵,Bozano Luisa²,Fernandez Jorge²,Lianto Prayudi⁵,Khasgiwale Niranjan²,Krishnan Siddarth²

Affiliation:

1. Applied Materials,Cambridge,MA,USA

2. Applied Materials,Santa Clara,CA,USA

3. Applied Materials,Albany,NY,USA

4. Applied Materials,Taichung City,Taiwan

5. Applied Materials,Singapore

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564958.pdf?arnumber=10564958

Reference5 articles.

1. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

2. Polymer Based Dual Damascene Process for Fine Pitch RDL Advanced Packaging

3. Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT^®) Packaging with Fine Pitch Embedded Trace RDL

4. Exploring Capabilities of Maskless Lithography for Dual—Image Exposure in FO WLP

5. Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications

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