Polymer Based Dual Damascene Process for Fine Pitch RDL Advanced Packaging-Reference-Cited by-同舟云学术

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Polymer Based Dual Damascene Process for Fine Pitch RDL Advanced Packaging

Published:2023-12-05 Issue: Volume: Page:391-395
ISSN:
Container-title:2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
language:
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Author:

Hsiang-Yao Hsiao¹,Ley Ryan²,Suo Peng²,Bum Andy Yong Chang²,Quon Roger³

Affiliation:

1. Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research),Singapore,138634

2. Applied Materials, Inc.,Packaging Process Integration, Applied Packaging Development Center,Singapore,117684

3. ICAPS at Applied Materials,Process Technology Research & Development,Albany,NY,United States of America,12203

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457887.pdf?arnumber=10457887

Reference6 articles.

1. Future Computing Hardware for AI

2. International Roadmap for Devices and Systems -2020 Update - More Moore,2020

3. One micron redistribution for fan-out wafer level packaging

4. Next Generation Panel-Scale RDL with Ultra Small Photo Vias and Ultra-Fine Embedded Trenches for Low Cost 2.5D Interposers and High Density Fan-Out WLPs

5. One micron redistribution for fan-out wafer level packaging

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Challenges and Innovations in Dual Damascene Polymer RDL with 2 μm Pitch and Beyond;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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