Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers-Reference-Cited by-同舟云学术

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Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers

Published:2024-05-28 Issue: Volume:122 Page:647-653
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Chery Emmanuel¹,Bhatia Ritwik²,Sundaram Ganesh²,Pinho Nelson¹,Beyne Eric¹

Affiliation:

1. imec,Leuven,Belgium

2. Veeco,Waltham,MA,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10582907.pdf?arnumber=10582907

Reference27 articles.

1. One micron redistribution for fan-out wafer level packaging

2. One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging using a Photosensitive Dielectric Material

3. Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers

4. Panel-Based Large-Scale RDL Interposer Fabricated Using 2-μm-Pitch Semi-Additive Process for Chiplet-Based Integration

5. Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT^®) Packaging with Fine Pitch Embedded Trace RDL

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