High Performance, High Density RDL for Advanced Packaging
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429606.pdf?arnumber=8429606
Cited by 31 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films;Nanomaterials;2023-09-26
2. Demonstration of Ultra-Fine RDLs Interposer Fabricated by Organic Dielectric CMP Process;2022 10th International Symposium on Next-Generation Electronics (ISNE);2023-05-12
3. Ultra-Fine Pitch Interconnects using a Novel Lift-off based Process of Thick Copper Films on Organic Substrate for Advanced Packaging;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10
4. Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. A Quantitative Evaluation of the Inelastic Energy Absorptions in Cu-Polyimide Interconnect and the Effect on Interface Debond Driving Force;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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