Funder
H2020 Marie Sklodowska-Curie Actions
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Reference55 articles.
1. W. W. Flack, R. Hsieh, H.-A. Nguyen, J. Slabbekoorn, S. Suhard, A. Miller, A. Hiro, and R. Ridremont, One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material, in Electronics Packaging Technology Conference (EPTC), Singapore, 04-07 December (2018)
2. C. H. Yu, L. J. Yen, C. Y. Hsieh, J. S. Hsieh, V. C. Y. Chang, C. H. Hsieh, C. S. Liu, C. T. Wang, K. Yee, and D. C. H. Yu, High performance, high density RDL for advanced packaging, in Electronic Components and Technology Conference (ECTC), San Diego, 29 May–01 June (2018)
3. H. Kudo, T. Takano, M. Tanaka, H. Mawatari, D. Kitayama, T. Tai, T. Tsunoda, S. Kuramochi, Panel-based large-scale RDL interposer fabricated using 2-μm-pitch semi-additive process for Chiplet-based integration, in Electronic Components and Technology Conference (ECTC), San Diego, 31 May–03 June (2022)
4. S. Jin, W. Do, J. Jeong, H. Cha, Y. Jeong, and J. Khim, Substrate silicon wafer integrated fan-out technology (S-SWIFT) packaging with fine pitch embedded trace RDL, in Electronic Components and Technology Conference (ECTC), San Diego, 31 May–03 June (2022)
5. E. Chery, J. Slabbekoorn, N. Pinho, A. Miller, and E. Beyne, Advances in photosensitive polymer based damascene RDL processes: toward submicrometer pitches with more metal layers, in Electronic Components and Technology Conference (ECTC), San Diego, 01 June–04 July (2021)
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