Fine Pitch Die-to-Wafer Hybrid Bonding
Author:
Affiliation:
1. Adeia, Inc.,San Jose,CA,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195430.pdf?arnumber=10195430
Reference12 articles.
1. Die to Wafer Stacking with Low Temperature Hybrid Bonding
2. High-speed ultra-accurate direct C2W bonding
3. Die to Wafer Hybrid Bonding and Fine Pitch Considerations
4. Nanoscale Topography Characterization for Direct Bond Interconnect
5. Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bonding with Copper Interconnect
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2. High-Throughput Characterization of Nanoscale Topography for Hybrid Bonding by Optical Interferometry;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Hybrid Bonding for Ultra-High-Density Interconnect;Journal of Electronic Packaging;2024-03-08
4. State of the Art of Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03
5. Cu-Cu Hybrid Bonding;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
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