1. Lau, J.H. 2023. Recent advances and trends in Cu-Cu hybrid bonding. IEEE Transactions on CPMT 13 (3): 399–425.
2. Lau, J.H. 2023. Chiplet design and heterogeneous integration packaging. New York: Springer.
3. Tong, Q., G. Fountain, and P. Enquist. 2000a. Method for low temperature bonding and bonded structure. U.S. Patent 6 902 987, Patented on Feb. 16, 2000.
4. Tong, Q., Fountain, G., Enquist, P. 2000b. Method for low temperature bonding and bonded structure. U.S. Patent 7 387 944, Patented on Feb. 16, 2000.
5. Tong, Q., G. Fountain, and P. Enquist. 2000c. Method for low temperature bonding and bonded structure. U.S. Patent 8 053 329, Patented on Feb. 16, 2000.