Author:
Brandstatter Birgit,Aschenwald Daniel,Auer Benedikt,Bilewicz Norbert,Boomsma Ruurd,Kroll Christoph,Mayr Andreas,Neumayr Richard,Rieser Hannes,Schernthaner Mario,Selhofer Hubert,Speer Florian,Unterwaditzer Peter,Videki Andras,Widauer Martin,Widmann Thomas
Cited by
18 articles.
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1. 3D Heterogeneous Integration with Sub-3μm Bond Pitch Chip-to-Wafer Hybrid Bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Fluidic Self Alignment for Hybrid Bonding Using Intel Process;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Hybrid Bonding for Ultra-High-Density Interconnect;Journal of Electronic Packaging;2024-03-08
4. FEA Simulations for Thermal Distributions of Large Scale 3DIC Packages;IEEE Access;2024
5. Alignment Vision System for Hybrid Bonding;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05