Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm-Reference-Cited by-同舟云学术

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Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm

Published:2024-05-28 Issue: Volume: Page:40-44
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Lin Ye¹,Bex Pieter¹,Kennes Koen¹,Derakhshandeh Jaber¹,Dhakras Prathamesh¹,Suhard Samuel¹,Gerets Carine¹,Dewilde Sven¹,Georgieva Violeta¹,Jourdain Anne¹,Beyer Gerald¹,Beyne Eric¹

Affiliation:

1. IMEC,Leuven,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565252.pdf?arnumber=10565252

Reference7 articles.

1. Die-to-Wafer Hybrid bonding Technology Roadmap;Beyne

2. Fine Pitch Die-to-Wafer Hybrid Bonding

3. Direct Die to Wafer Cu Hybrid Bonding for Volume Production

4. Integration of plasma dicing in the collective die to wafer hybrid bonding process

5. Demonstration of a collective hybrid die-to-wafer integration using glass carrier

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