Integration of plasma dicing in the collective die to wafer hybrid bonding process-Reference-Cited by-同舟云学术

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Integration of plasma dicing in the collective die to wafer hybrid bonding process

Published:2023-12-05 Issue: Volume: Page:144-149
ISSN:
Container-title:2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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Author:

Suhard Samuel¹,Kennes Koen¹,Bex Pieter¹,Georgieva Violeta¹,Schleicher Filip²,Walsby Edward²,Barnett Richard²,Jourdain Anne¹,Beyer Gerald¹,Beyne Eric¹

Affiliation:

1. Imec,Heverlee,Belgium,3001

2. KLA Corp,U.K

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457656.pdf?arnumber=10457656

Reference7 articles.

1. Heterogeneous Integration by Collective Die-To-Wafer Bonding

2. Demonstration of a collective hybrid die-to-wafer integration

3. Demonstration of a collective hybrid die-to-wafer integration using glass carrier

4. Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding

5. Small Pitch, High Aspect Ratio Via-Last TSV Module

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multi-tier die stacking through collective die-to-wafer hybrid bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Collective die-to-wafer assembly process for optically interconnected System-on-wafer;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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