Author:
Suhard Samuel,Phommahaxay Alain,Kennes Koen,Bex Pieter,Fodor Ferenc,Liebens Maarten,Slabbekoorn John,Miller Andy,Beyer Gerald,Beyne Eric
Cited by
14 articles.
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1. Multi-tier die stacking through collective die-to-wafer hybrid bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Collective die-to-wafer assembly process for optically interconnected System-on-wafer;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Hybrid Bonding for Ultra-High-Density Interconnect;Journal of Electronic Packaging;2024-03-08
4. Integration of plasma dicing in the collective die to wafer hybrid bonding process;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
5. Recent Advances and Trends in Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03