Small Pitch, High Aspect Ratio Via-Last TSV Module-Reference-Cited by-同舟云学术

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Small Pitch, High Aspect Ratio Via-Last TSV Module

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Van Huylenbroeck Stefaan,Stucchi Michele,Li Yunlong,Slabbekoorn John,Tutunjyan Nina,Sardo Stefano,Jourdan Nicolas,Bogaerts Lieve,Beirnaert Filip,Beyer Gerald,Beyne Eric

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545409.pdf?arnumber=7545409

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