Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications-Reference-Cited by-同舟云学术

Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications

Published:2024-02-22 Issue:5 Volume:13 Page:839
ISSN:2079-9292
Container-title:Electronics
language:en
Short-container-title:Electronics

Author:

Yin Yuhang¹,Xia Chenhui¹,Liu Shuli¹,Zhang Zhimo¹,Chen Chen²,Wang Gang¹,Wang Chenqian¹,Wu Yafei³^ORCID

Affiliation:

1. The 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214035, China

2. School of Electronic Science & Engineering, Southeast University, Wuxi 214111, China

3. School of Electronic Science and Engineering, University of Electronic Science and Technology of China (UESTC), Chengdu 611731, China

Abstract

In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications.

Publisher

MDPI AG

Link

https://www.mdpi.com/2079-9292/13/5/839/pdf

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