Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN–SiCN Wafer-to-Wafer Hybrid-Bonding Technologies
Author:
Affiliation:
1. Advanced Robustness, Reliability and Test, IMEC, Leuven, Belgium
2. CMOS Technologies, IMEC, Leuven, Belgium
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/7298/10346019/10296057.pdf?arnumber=10296057
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