Advanced Packaging Technology Platforms for Chiplets and Heterogeneous Integration-Reference-Cited by-同舟云学术

Advanced Packaging Technology Platforms for Chiplets and Heterogeneous Integration

Published:2022-12-03 Issue: Volume: Page:
ISSN:
Container-title:2022 International Electron Devices Meeting (IEDM)
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Author:

Cao Lihong¹

Affiliation:

1. Engineering & Technical Promotion, ASE. (US) Inc.,Austin,TX,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10019319/10019320/10019534.pdf?arnumber=10019534

Reference7 articles.

1. What the chiplet-based Future of Compute Means for Comments and Technology;naffziger;2021 IEEE 71th Electronic Components and Technology Conference (ECTC),0

2. Process Modules for High-Density Interconnects in Panel-Level Packaging

3. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

4. A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last

5. A Production-worthy Fan-Out Solution - ASE FOCoS Chip Last

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