Advanced Packaging Technology Platforms for Chiplets and Heterogeneous Integration
Author:
Affiliation:
1. Engineering & Technical Promotion, ASE. (US) Inc.,Austin,TX,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10019319/10019320/10019534.pdf?arnumber=10019534
Reference7 articles.
1. What the chiplet-based Future of Compute Means for Comments and Technology;naffziger;2021 IEEE 71th Electronic Components and Technology Conference (ECTC),0
2. Process Modules for High-Density Interconnects in Panel-Level Packaging
3. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect
4. A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last
5. A Production-worthy Fan-Out Solution - ASE FOCoS Chip Last
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2. Thermal Analysis of 3D Heterogeneous Integration for Microwave HEMTs;2023 IEEE XVI International Scientific and Technical Conference Actual Problems of Electronic Instrument Engineering (APEIE);2023-11-10
3. Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films;Nanomaterials;2023-09-26
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