Process Modules for High-Density Interconnects in Panel-Level Packaging-Reference-Cited by-同舟云学术

Process Modules for High-Density Interconnects in Panel-Level Packaging

Published:2020-01 Issue:1 Volume:10 Page:5-10
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Schein Friedrich-Leonhard¹^ORCID,Kahle Ruben²,Kunz Marc³,Kunz Tim³,Kossev Jordan⁴,Muller Tobias⁴^ORCID,Pentz Mathias⁵,Dietterle Michael⁵,Ostmann Andreas²

Affiliation:

1. Felix Bloch Institute for Solid State Physics, University of Leipzig, Leipzig, Germany

2. Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany

3. Schmoll Maschinen GmbH, Rödermark, Germany

4. CREAVAC Creative Vakuumbeschichtung GmbH, Dresden, Germany

5. Dr.-Ing. Max Schlötter GmbH & Co. KG, Geislingen, Germany

Funder

Bundesministerium für Bildung und Forschung

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/8960661/08915835.pdf?arnumber=8915835

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3. Comparison of Mechanical Modeling to Warpage Estimation of RDL-First Fan-Out Panel-Level Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-07

4. Advanced HDFO Packaging Solutions for Chiplets Integration in HPC Application;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

5. 3D integration technology with photosensitive mold for fan-out package;Japanese Journal of Applied Physics;2021-03-17