Modern Trends in Microelectronics Packaging Reliability Testing-Reference-Cited by-同舟云学术

Modern Trends in Microelectronics Packaging Reliability Testing

Published:2024-03-15 Issue:3 Volume:15 Page:398
ISSN:2072-666X
Container-title:Micromachines
language:en
Short-container-title:Micromachines

Author:

Bender Emmanuel¹²,Bernstein Joseph B.²^ORCID,Boning Duane S.¹^ORCID

Affiliation:

1. Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA 02142, USA

2. Electrical and Electronics Engineering, Ariel University, Ariel 40700, Israel

Abstract

In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes.

Funder

MISTI MIT Israel Lockheed Martin Seed Fund

Publisher

MDPI AG

Link

https://www.mdpi.com/2072-666X/15/3/398/pdf

Reference119 articles.

1. Qin, I., Yauw, O., Schulze, G., Shah, A., Chylak, B., and Wong, N. (June, January 30). Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package. Proceedings of the 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA.

2. Packaging Reliability-How to Define and Measure It;Howard;IEEE Trans. Compon. Hybrids Manuf. Technol.,1982

3. Lau, J. (1994). Chip on Board Technologies for Multichip Modules, Van Nostrand Reinhold.

4. Lau, J., and Pao, Y. (1997). Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill.

5. Lau, J.H. (2021). Semiconductor Advanced Packaging, Springer Publishers.