Demonstration of a collective hybrid die-to-wafer integration using glass carrier-Reference-Cited by-同舟云学术

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Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Suhard Samuel,Kennes Koen,Bex Pieter,Jourdain Anne,Teugels Lieve,Walsby Edward,Bolton Chris,Patel Jash,Ashraf Huma,Barnett Richard,Fodor Ferenc,Phommahaxay Alain,La Tulipe Douglas,Beyer Gerald,Beyne Eric

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501767.pdf?arnumber=9501767

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multi-tier die stacking through collective die-to-wafer hybrid bonding;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Collective die-to-wafer assembly process for optically interconnected System-on-wafer;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Comparison of Organic and Inorganic Dielectric Hybrid Bonding with Highly <111>-Oriented Nanotwinned Cu;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. Research progress of hybrid bonding technology for three-dimensional integration;Microelectronics Reliability;2024-04

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