A Thermally Friendly Bonding Scheme for 3D System Integration-Reference-Cited by-同舟云学术

A Thermally Friendly Bonding Scheme for 3D System Integration

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Kuo Gordon¹,Chen Chih-Yuan¹,Hsieh Cheng-Chieh¹,Lee Chung-Ju¹,Wu Jason¹,Cui Ji James¹,Kuo Yen-Liang¹,Tung Chih-Hang¹,Ku Terry¹,Tsai Chung-Hao¹,Yee Kuo-Chung¹,Yu Douglas C.H.¹

Affiliation:

1. Taiwan Semiconductor Manufacturing Company, Ltd,Hsinchu,Taiwan, R.O.C

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195788.pdf?arnumber=10195788

Reference5 articles.

1. System on Integrated Chips (SoIC(TM) for 3D Heterogeneous Integration

2. SoIC for Low-Temperature, Multi-Layer 3D Memory Integration

3. Advanced heterogeneous integration technology trend for cloud and edge

4. Foundry Perspectives on2.5D/3D Integration and Roadmap;yu;2021 IEEE International Electron Devices Meeting (IEDM),0

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