SoIC for Low-Temperature, Multi-Layer 3D Memory Integration-Reference-Cited by-同舟云学术

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SoIC for Low-Temperature, Multi-Layer 3D Memory Integration

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Chen M. F.,Lin C. S.,Liao E. B.,Chiou W. C.,Kuo C. C.,Hu C. C.,Tsai C. H.,Wang C. T.,Yu Douglas

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159340.pdf?arnumber=9159340

Cited by 36 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Effect of (111) Surface Ratio on the Bonding Quality of Cu-Cu Joints;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Characteristics analysis and structure optimization of a hybrid micro-jet impingement/micro-channel heat sink;Applied Thermal Engineering;2024-05

4. Instant Test and Repair for TSVs using Differential Signaling;Journal of Electronic Testing;2024-04

5. Hybrid Bonding for Ultra-High-Density Interconnect;Journal of Electronic Packaging;2024-03-08

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